User:Saoni: Difference between revisions

From Intelligent Materials and Systems Lab

No edit summary
No edit summary
Line 18: Line 18:


== Publications ==
== Publications ==


=== Journal Articles ===
=== Journal Articles ===
Line 23: Line 24:
* [https://doi.org/10.1109/jsen.2018.2797526 <nowiki>A Comprehensive High-Level Model for CMOS-MEMS Resonators</nowiki>], IEEE Sensors Journal, 2018.
* [https://doi.org/10.1109/jsen.2018.2797526 <nowiki>A Comprehensive High-Level Model for CMOS-MEMS Resonators</nowiki>], IEEE Sensors Journal, 2018.
* [https://doi.org/10.1007/s00542-016-2878-3 <nowiki>CMOS-MEMS resonant pressure sensors: Optimization and validation through comparative analysis</nowiki>], Microsystem Technologies, 2017.
* [https://doi.org/10.1007/s00542-016-2878-3 <nowiki>CMOS-MEMS resonant pressure sensors: Optimization and validation through comparative analysis</nowiki>], Microsystem Technologies, 2017.
* [https://doi.org/10.1109/jsen.2017.2747140 <nowiki>Characterization of CMOS-MEMS Resonant Pressure Sensors</nowiki>], IEEE Sensors Journal, 2017.=== Conference Papers ===
* [https://doi.org/10.1109/jsen.2017.2747140 <nowiki>Characterization of CMOS-MEMS Resonant Pressure Sensors</nowiki>], IEEE Sensors Journal, 2017.
=== Conference Papers ===


* [https://doi.org/10.1109/icsens.2016.7808403 <nowiki>Temperature and pressure characterization of the quality factor in a CMOS-MEMS resonator</nowiki>], 2016 Ieee Sensors, 2016.
* [https://doi.org/10.1109/icsens.2016.7808403 <nowiki>Temperature and pressure characterization of the quality factor in a CMOS-MEMS resonator</nowiki>], 2016 Ieee Sensors, 2016.
Line 29: Line 31:
* [https://doi.org/10.1109/dtip.2015.7160984 <nowiki>Optimization of parameters for CMOS MEMS resonant pressure sensors</nowiki>], 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015.
* [https://doi.org/10.1109/dtip.2015.7160984 <nowiki>Optimization of parameters for CMOS MEMS resonant pressure sensors</nowiki>], 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015.
* [https://doi.org/10.1109/imws-bio.2013.6756176 <nowiki>CMUT ultrasonic power link front-end for wireless power transfer deep in body</nowiki>], 2013 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-BIO), 2013.
* [https://doi.org/10.1109/imws-bio.2013.6756176 <nowiki>CMUT ultrasonic power link front-end for wireless power transfer deep in body</nowiki>], 2013 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-BIO), 2013.
* ''Face recognition using K2DSPCA'', Proceedings of the International Conference on Information and Network Technology, 2011.=== Other ===
* ''Face recognition using K2DSPCA'', Proceedings of the International Conference on Information and Network Technology, 2011.
=== Other ===


* [https://repository.ntu.edu.sg/handle/10356/59966 <nowiki>Ultrasonic Link IC for Wireless Power and Data Transfer Deep in Body</nowiki>], 2012.
* [https://repository.ntu.edu.sg/handle/10356/59966 <nowiki>Ultrasonic Link IC for Wireless Power and Data Transfer Deep in Body</nowiki>], 2012.

Revision as of 18:09, 9 September 2019

Publications

Journal Articles

Conference Papers

Other

MSc thesis